Via Depth Measurement System

VIANCA Series

NEW
VIANCA Series

Measuring the depth of small-diameter, high-aspect-ratio vias for 3D / 2.5D / Hybrid bonding packaging processes

Topics

Features

  • Lasertec’s proprietary optics enabling the measurement of the depth of small-diameter, high-aspect-ratio TSVs
  • Supporting next-generation TSV architectures

Applications

  • Depth measurement after via etching
  • Copper recess level control for hybrid bonding
  • Height measurement after copper pillar revealing and during bump formation

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