SiC Wafer Inspection and Review System
SICA108
NEW
Providing high-speed, concurrent surface and photoluminescence (PL) inspection specialized in detecting SiC defects
Topics
Features
- Concurrent inspection of surface defects and BPD/SF at high speed and with high sensitivity
- Detailed classification of various defect types using high-accuracy Automatic Defect Classification (ADC) and high-resolution review images
- Compatible with various automation systems, including AGV and OHT
Applications
- Incoming and outgoing inspection of SiC bare wafers and SiC Epi wafers
- Monitoring of SiC epitaxial growth processes
- Monitoring of SiC polishing processes
- Management of SiC device manufacturing processes
