Dividends and shareholder benefits

1. Dividend policy

Our basic policy concerning dividends is to set the guideline of our dividend payout ratio at 35% on a consolidated basis and pay dividends flexibly based on performance.

We use retained earnings for new technology/product R&D and for infrastructure and working capital necessary for business growth in order to strengthen business foundation and increase shareholder value.

2. History of dividend payouts

Fiscal year	Effective date	Dividends per share	Payout date
Year-end dividend for FY ended June 30, 2024	June 30, 2024	157.0yen	September 27, 2024
Interim dividend for FY ended June 30, 2024	December 31, 2023	73.0yen	March 06, 2024
Year-end dividend for FY ended June 30, 2023	June 30, 2023	128.0 yen	September 29, 2023
Interim dividend for FY ended June 30, 2023	December 31, 2022	52.0 yen	March 08, 2023
Year-end dividend for FY ended June 30, 2022	June 30, 2022	65.0 yen	September 29, 2022
Interim dividend for FY ended June 30, 2022	December 31, 2021	32.0 yen	March 04, 2022
Year-end dividend for FY ended June 30, 2021	June 30, 2021	55.0 yen	September 29, 2021
Interim dividend for FY ended June 30, 2021	December 31, 2020	20.0 yen	March 05, 2021
Year-end dividend for FY ended June 30, 2020	June 30, 2020	27.0 yen	September 29, 2020
Interim dividend for FY ended June 30, 2020	December 31, 2019	15.5 yen	March 06, 2020

*On January 1, 2020, Lasertec split its common stock 2 for 1. For ease of comparison, the figures above are calculated as if the stock split occurred at the beginning of the fiscal year ending June 2020.