As the design of semiconductors becomes increasingly downsized and multilayered, chipmakers find smaller and more diverse defects originating from the wafer edge. This has led to a growing demand for a tool that can detect and identify only those defects that negatively affect yields in semiconductor production among a multitude of defects.

The CIEL series introduces newly designed proprietary optics, a complete makeover from EZ300’s, to achieve high-sensitivity, high-throughput inspection. It is designed to identify defects of interest accurately by using highly accurate defect classification based on deep learning and by capturing high-resolution images containing height/depth information with the 3D profiling function of our proprietary optics.

Lasertec will continue to support the needs of leading-edge semiconductor manufacturing processes and contribute to the efforts of quality and yield enhancement.